Henkel’s hot water debondable epoxy simplifies solar silicon wafer slicing

August 24, 2011 By admin Leave a Comment

Henkel has introduced ‘Loctite 3382’ in an effort to simplify silicon ingot bonding and protect against wafer breakages. Loctite 3382 provides improved bonding strength of the ingot in the sawing process and is de-bondable in hot water. This new bonding solution helps to avoid corrosion of the equipment and is free of caustic odor.

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Henkel’s hot water debondable epoxy simplifies solar silicon wafer slicing

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