Engineered Conductive Materials (ECM) has introduced a fast curing conductive adhesive, DB-1590 for use as a solder replacement in next-generation crystalline silicon solar modules using thinned silicon and/or plated bus bars. This material formulation has been optimized to provide improved conductivity and stability on various substrates when cured at 200°C.
ECM’s spot curing conductive adhesive DB-1590 designed for thin wafers
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