New Product: Stangl’s new wet line removes silicon-chunk surface contaminants

Product Briefing Outline: Stangl Semiconductor Equipment AG is introducing a new wet chemical etching tool, the Materia Pce, for removing surface contaminants from chunks of polysilicon or upgraded metallurgical silicon (UMG) as a result of the crushing process.

New Product: Stangl’s new wet line removes silicon-chunk surface contaminants

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